Download the Call for Papers in PDF version
here.
You are invited to participate and submit your contributions to ETS'18. The following topic chairs have been selected to
put particular emphasis on their topic:
P. Bernardi:
Microprocessor and On-line Test, K. Chakrabarty:
Emerging Technologies in Test, P. Girard:
Power Issues in Test,
S. Hamdioui:
Memory and Nanotechnology Test, E. Larsson:
Test Architectures and Standards, G. Léger:
Analog/Mixed
Signal Test , M. Maniatakos:
Security and Trust Issues in Test, I. Polian:
Test Generation and Reliability, J. Rivoir:
Automatic
Test Equipment and Yield, C. Scholl:
Validation and Verification, A. Singh:
Defect-based Test and Variability.
The areas of interest include (but are not limited to) the following topics:
- Analog Test
- ATE Hardware and Software
- Automatic Test Generation
- Board Test and Diagnosis
- Boundary Scan Test
- Built-In Self-Test (BIST)
- Current-Based Test
- Defect-Based Test
- Delay and Performance Test
- Dependability and Functional Safety
- Design for Test (DfT)
- Design for Manufacturing (DfM)
- Diagnosis and Silicon Debug
- Economics of Test
- Test of Emerging Technologies
- Failure Analysis
- Fault Injection
- Fault Modeling and Simulation
- Fault Tolerance
- GPU Test
- Hardware Trojans
- Hardware and IP Security Test and Verification
- High-Speed I/O Test
- Low-Power IC Test
- Memory Test and Repair
- MEMS Test
- Microprocessor Test
- Mixed-Signal Test
- Multi-/Many-core Processor Test
- Nanotechnology Test
- On-line Test
- Power Issues in Test
- Reconfigurable System Test
- Reliability
- Reliability-Security Trade-offs
- RF Test
- Security and Trust Issues in Test
- Self-Repair
- Sensor Test
- Side-channels Analysis
- Signal Integrity Test
- SiP, Stacked, 3D IC Test
- SoC Test
- Soft Errors
- Standards in Test
- Statistical Learning in Test
- Test Compression
- Test Quality
- Test Synthesis
- Thermal Issues in Test
- Validation and Verification
- Variability Issues in Test
- Yield Analysis and Enhancement
Guidelines for Authors
Prospective authors are invited to submit novel, unpublished, and complete research contributions. Each submitted scientific paper should be a complete
PDF manuscript, up to six (6) pages (inclusive of all figures, tables, and bibliography) in a standard IEEE format. The IEEE template can be found
here.
Papers not compliant with the IEEE template or exceeding the page limit will be returned without review.
A submitted scientific paper can be accepted for
oral presentation or for
poster presentation.
ETS fully complies with the IEEE publication policies regarding double submissions, plagiarism, etc. Authors unfamiliar with the IEEE official rules regarding
double submissions and IEEE ethics are advised to read the Publication Guidelines section of the IEEE PSPB Operations Manual that can be found
here.
A submission of a scientific paper is considered a commitment that, upon acceptance, authors will submit their camera-ready version for inclusion in the formal
Proceedings and will present the paper (or the poster) at the symposium. Each accepted contribution must have at least one full paid registration by the time the
camera ready paper is submitted for inclusion in the proceedings. ETS reserves the right to remove from IEEE Xplore papers and posters not presented at the symposium.
Camera-ready Submissions
Important information about the Camera-ready Submissions can be found
here.
Key Dates
Paper Submission Deadline:
December 4, 2017 December 12, 2017
Notification of acceptance:
February 13, 2018
Camera-ready manuscript:
March 18, 2018
Submission Website
Submissions should be made electronically as a single PDF file
here.
Publications
ETS'18 will produce electronic formal Proceedings including all scientific papers, with ISBN number to be indexed in the IEEE Xplore Digital Library and other
bibliographical search engines.
Scientific papers accepted for
oral presentation require a final 6-page manuscript for inclusion in the formal Proceedings while scientific papers accepted
for
poster presentation require a final 2-page manuscript for inclusion in the formal Proceedings.
Best Paper Award
The Best Paper Award of ETS'18 will be presented at ETS'19.
Contact Information
For more information, please contact the Program Chair
Bernd Becker.